Contact Smart Card and Method of Forming Such
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United States of America Patent
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Issued Date -
Feb 9, 2017
app pub date -
Jul 13, 2016
filing date -
Aug 3, 2015
priority date (Note) -
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status (Latency Note)
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Abstract
Contact smart card has a smart card contact pad and an IC chip. The smart card contact pad has a circuit substrate with a plurality of via holes there through, a card-reader contact element on a first side of the circuit substrate, and a plurality of chip connection elements on a second side of the circuit substrate. Each chip connection element is associated with a via hole through the circuit substrate. The card-reader contact element has an electrically conductive surface. The plurality of chip connection elements define a chip engagement region on the second side of the circuit substrate. The IC chip is mounted on the chip engagement region and electrically connected to the card-reader contact element through the via holes.
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