PLASMA ETCHING DEVICE WITH PLASMA ETCH RESISTANT COATING

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United States of America Patent

SERIAL NO

14817115

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An apparatus for use in a plasma processing chamber is provided. The apparatus comprises part body and a coating with a thickness of no more than 30 microns consisting essentially of a Lanthanide series or Group III or Group IV element in an oxyfluoride covering a surface of the part body.

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Patent Owner(s)

Patent OwnerAddress
LAM RESEARCH CORPORATION4650 CUSHING PARKWAY FREMONT CA 94538

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
DAUGHERTY, John Fremont, US 72 950
HUANG, Lihua Li Pleasanton, US 13 1096
SHIH, Hong Santa Clara, US 104 3498
XU, Lin Katy, US 198 5082

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