Picture frame stiffeners for microelectronic packages

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9685388
APP PUB NO 20170040238A1
SERIAL NO

15296995

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A microelectronic package may be formed with a picture frame stiffener surrounding a microelectronic die for reducing warpage of the microelectronic package. An embodiment for fabricating such a microelectronic package may include forming a microelectronic die having an active surface and an opposing back surface, wherein the microelectronic die active surface may be attached to a microelectronic substrate. A picture frame stiffener having an opening therethrough may be formed and placed on a release film, wherein a mold material may be deposited over the picture frame stiffener and the release film. The microelectronic die may be inserted into the mold material, wherein at least a portion of the microelectronic die extends into the picture frame opening. The release film may be removed and a portion of the mold material extending over the microelectronic die back surface may then be removed to form the microelectronic package.

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First Claim

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Patent Owner(s)

  • INTEL CORPORATION

International Classification(s)

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  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Deshpande, Nitin A Chandler, US 69 410
Ichikawa, Kinya Tsukuba, JP 27 881
Karhade, Omkar G Chandler, US 76 522
Kubota, Jiro Tsukuba, JP 9 275
Liff, Shawna M Scottsdale, US 195 1157
Tomita, Yoshihiro Tsukuba, JP 174 2308

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