PACKAGE STRUCTURE OF A LIGHT-EMITTING DEVICE

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United States of America Patent

APP PUB NO 20170040262A1
SERIAL NO

15000048

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Abstract

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A light-emitting device packaging structure is provided. The light-emitting device packaging structure includes a substrate, an array of light-emitting devices, an encapsulating layer, scattering particles, and a fluorescent material layer. The array of light-emitting devices is on the substrate. The encapsulating layer covers the array of light-emitting devices. The scattering particles are dispersed in the encapsulating layer. The fluorescent material layer is on the encapsulating layer.

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Patent Owner(s)

Patent OwnerAddress
NATIONAL CHIAO TUNG UNIVERSITYHSINCHU CITY 300

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Kuo-Ju Taichung City, TW 56 82
Han, Hau-Vei Hsinchu City, TW 3 3
Kuo, Hao-Chung Hsinchu County, TW 69 336
Lin, Chien-Chung Taipei City, TW 29 100
Sher, Chin-Wei Hsinchu County, TW 1 1
Tu, Hsien-Hao Hsinchu City, TW 1 1
Tu, Zong-Yi Tainan City, TW 1 1

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