Electronic circuit device and heat sink structure for the same
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United States of America Patent
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May 22, 2018
Issued Date -
N/A
app pub date -
Aug 4, 2016
filing date -
Aug 5, 2015
priority date (Note) -
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Abstract
An electronic circuit device and a heat sink structure for the electronic circuit device capable of simultaneously achieving improved space efficiency and safeness are provided. The electronic circuit device includes: a substrate with circuit wiring formed thereon; an electronic component requiring heat dissipation, which is mounted on the substrate; and a heat sink structure configured to dissipate heat radiated by the electronic component requiring heat dissipation. The heat sink structure includes: a contact part to be in direct or indirect contact with the electronic component requiring heat dissipation; a generally tabular heat-dissipating part disposed substantially parallel to the substrate; and a connection part configured to connect between the contact part and the heat-dissipating part.
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