Liquid-cooled, composite heat sink assemblies

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 10160072
APP PUB NO 20170043437A1
SERIAL NO

14922338

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Abstract

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A method of fabricating a liquid-cooled heat sink assembly, including: providing a heat transfer element including a heat transfer base having opposite first and second sides, and a plurality of thermally conductive fins extending from the first side of the heat transfer base, the second side of the heat transfer base to couple to a component(s) to be cooled; providing a coolant-carrying structure including a coolant-carrying base and a coolant-carrying compartment through which liquid coolant flows, the coolant-carrying base including a plurality of fin-receiving openings sized and positioned for the plurality of thermally conductive fins of the heat sink base to extend through; and attaching the heat transfer element and coolant-carrying structure together with the plurality of thermally conductive fins extending through the fin-receiving openings in the coolant-carrying base into the coolant-carrying compartment.

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Patent Owner(s)

  • IBM CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Boday, Dylan J Tucson, US 268 1387
Campbell, Levi A Poughkeepsie, US 279 10488
David, Milnes P Fishkill, US 155 3126
Demetriou, Dustin W Poughkeepsie, US 43 424
Ellsworth,, Jr Michael J Poughkeepsie, US 251 7912
Schmidt, Roger R Poughkeepsie, US 272 10636
Simons, Robert E Poughkeepsie, US 312 15022
Singh, Prabjit Poughkeepsie, US 93 1198
Wertz, Jason T Pleasant Valley, US 300 623

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