HIGH-SPEED FILLING METHOD FOR COPPER
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United States of America Patent
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Issued Date -
Feb 16, 2017
app pub date -
Apr 25, 2014
filing date -
Apr 25, 2014
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Abstract
To provide a technique of increasing a rate of filling holes or grooves formed in a substrate, by changing the temperature, the concentration, the current density, and the other conditions of the ordinary copper plating. A method for filling holes or grooves formed in a substrate by copper plating at a high speed, containing: immersing the substrate having the holes or grooves in an acidic copper plating solution containing a copper ion, a sulfate ion, and a halide ion, at from 30 to 70° C.; and plating the substrate at a current density of 3 A/dm2 or more by using an insoluble electrode as an anode.
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