PACKAGING ARRANGEMENTS INCLUDING A SERIALIZING DRAM INTERFACE DIE

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United States of America Patent

APP PUB NO 20170047305A1
SERIAL NO

15228859

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Abstract

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Embodiments provide a packaging arrangement that comprises a package substrate. A random access memory die is coupled to the package substrate and a serializing random access memory interface die coupled to (i) the package substrate and (ii) the random access memory die.

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Patent Owner(s)

Patent OwnerAddress
MARVELL WORLD TRADE LTDNot Provided

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Liou, Shiann-Ming Campbell, US 76 438
Liu, Chenglin Cupertino, US 59 210

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