PACKAGING ARRANGEMENTS INCLUDING A SERIALIZING DRAM INTERFACE DIE
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United States of America Patent
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Issued Date -
Feb 16, 2017
app pub date -
Aug 4, 2016
filing date -
Aug 13, 2015
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Abstract
Embodiments provide a packaging arrangement that comprises a package substrate. A random access memory die is coupled to the package substrate and a serializing random access memory interface die coupled to (i) the package substrate and (ii) the random access memory die.
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