SENSING CHIP PACKAGE AND A MANUFACTURING METHOD THEREOF
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United States of America Patent
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Aug 8, 2016
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Aug 12, 2015
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Abstract
This present invention provides a novel sensing chip package and a manufacturing method thereof, and in particular provides a proximity sensing chip package and a manufacturing thereof, which is characterized by forming a light blocking layer surrounding the light emitting device of the sensor to block the lateral light emitted by the light emitting device to reduce the interference of the lateral light and enhance the sensitivity of the light sensing device.
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