Printed wiring board
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United States of America Patent
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Oct 31, 2017
Issued Date -
N/A
app pub date -
May 15, 2015
filing date -
May 21, 2014
priority date (Note) -
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status (Latency Note)
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Abstract
A printed wiring board is provided which comprises a first insulating substrate (11) composed of a liquid crystal polymer, a first signal line (131) formed on one main surface (11a) of the first insulating substrate (11), a second insulating substrate (21) composed of a liquid crystal polymer, a second signal line (231) formed on one main surface (21a) of the second insulating substrate (21) and along the extending direction of the first signal line (131), and an adhesion layer (30) composed of a modified polyphenylene ether for adhesion between the one main surface (11a) of the first insulating substrate (11) and the one main surface (21a) of the second insulating substrate (21). When frequencies of signals transmitted by the first signal line and the second signal line are 2.5 GHz or more and 5.0 GHz or less, an offset amount is longer than a circuit width (L1) of the first signal line (131) and 130 μm or more and 300 μm or less. The offset amount is a distance from the position of one end of the first signal line (131) among ends along the width direction to the position of one end of the second signal line (231) among ends along the width direction.
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