Stabilization of metallic nanowire meshes via encapsulation
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United States of America Patent
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Jun 4, 2019
Grant Date -
Mar 2, 2017
app pub date -
Sep 1, 2015
filing date -
Sep 1, 2015
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Abstract
Techniques for mechanically stabilizing metallic nanowire meshes using encapsulation are provided. In one aspect, a method for forming a mechanically-stabilized metallic nanowire mesh is provided which includes the steps of: forming the metallic nanowire mesh on a substrate; and coating the metallic nanowire mesh with a metal oxide that encapsulates the metallic nanowire mesh to mechanically-stabilize the metallic nanowire mesh which permits the metallic nanowire mesh to remain conductive at temperatures greater than or equal to about 600° C. A mechanically-stabilized metallic nanowire mesh is also provided.
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