Sensor unit having an adhesive member connected to an outer edge of a sensor device and placed continuously in an area overlapping a sensor device

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United States of America Patent

PATENT NO 10228269
APP PUB NO 20170059605A1
SERIAL NO

15246879

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Abstract

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A sensor unit includes: a sensor device including an inertial sensor; a substrate to which the sensor device is bonded; a case member accommodating at least the sensor device; and an adhesive member provided to cover, in a plan view of the substrate as viewed from the case member side, an outer periphery of the sensor device and so as to connect the sensor device with the case member.

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Patent Owner(s)

  • SEIKO EPSON CORPORTION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ito, Keita Chino, JP 70 483
Kinoshita, Yusuke Minowa, JP 166 994
Saito, Yoshikuni Suwa, JP 27 385

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