Modular array of vertically integrated superconducting qubit devices for scalable quantum computing

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United States of America Patent

PATENT NO 10169714
APP PUB NO 20170061317A1
SERIAL NO

15347160

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Abstract

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A technique relates to an assembly for a quantum computing device. A quantum bus plane includes a first set of recesses. A readout plane includes a second set of recesses. A block is positioned to hold the readout plane opposite the quantum bus plane, such that the first set of recesses opposes the second set of recesses. A plurality of qubit chips are included where each has a first end positioned in the first set of recesses and has a second end positioned in the second set of recesses.

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Patent Owner(s)

  • IBM CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chow, Jerry M White Plains, US 85 628
Gambetta, Jay M Yorktown Heights, US 136 1235
Rothwell, Mary B Ridgefield, US 17 247
Rozen, James R Peekskill, US 22 370

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