METHOD FOR MANUFACTURING MULTILAYER SUBSTRATE
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Mar 2, 2017
app pub date -
Aug 24, 2015
filing date -
Aug 24, 2015
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
In a method for manufacturing a multilayer substrate, first, a via hole is formed in a first insulating layer and a second insulating layer and filled with conductive paste. Subsequently, the first insulating layer and the second insulating layer are stacked on each other. Next, the conductive paste is cured to form a via conductor while the first insulating layer and the second insulating layer are integrated through thermal pressing. Then, a penetrating hole that penetrates the via conductor in the laminating direction is formed.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully