METHOD FOR MANUFACTURING COIL LOADING BOARD

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United States of America Patent

APP PUB NO 20170062125A1
SERIAL NO

14881279

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Abstract

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A method for manufacturing a coil loading board includes following steps: providing a first plate configured single-side adhesive and double-side adhesive on both sides thereof; defining a first slot, a first through hole, a first connection hole and a groove through both sides of the first plate; providing a second plate configured double-die adhesive on a side thereof; forming a second slot, a second through hole and a second connection hole through both sides of the second plate; fixing the first plate and the second plate together; removing the single-side adhesive of the first plate.

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Patent Owner(s)

Patent OwnerAddress
FOXCONN TECHNOLOGY CO LTD(236)NO 3-2 CHUNG SHAN ROAD TU-CHENG DIST NEW TAIPEI 236

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
LEE, Chia-Chin New Taipei, TW 4 3

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