Semiconductor manufacturing apparatus and semiconductor manufacturing method
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United States of America Patent
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Apr 25, 2017
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N/A
app pub date -
Feb 5, 2016
filing date -
Aug 31, 2015
priority date (Note) -
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Abstract
A semiconductor manufacturing apparatus according to an embodiment includes a reactor, a mover, and a controller. The reactor houses an outer edge portion of a semiconductor substrate in inside thereof through a gap portion and scrapes the outer edge portion. The mover moves at least either the semiconductor substrate or end faces of the gap portion in a thickness direction of the semiconductor substrate to change distances in the thickness direction between the semiconductor substrate and the end faces of the gap portion. The controller controls a movement amount in the thickness direction of at least either the semiconductor substrate or the end faces of the gap portion according to a warp amount of the outer edge portion in the thickness direction.
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