SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
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United States of America Patent
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Nov 11, 2016
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Apr 15, 2013
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Abstract
There are included: forming element isolation regions in a semiconductor substrate; introducing a first impurity of a first conductivity type, to thereby form a first well and a second well of the first conductivity type; introducing a second impurity of a second conductivity type, to thereby form a third well of the second conductivity type and introducing the second impurity into a region between the first well and the second well, to thereby form a separation well of the second conductivity type; and further introducing a third impurity of the second conductivity type into the region between the first well and the second well.
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