SEMICONDUCTOR CHIP MODULE
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United States of America Patent
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Issued Date -
Mar 2, 2017
app pub date -
Aug 26, 2015
filing date -
Aug 26, 2015
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A semiconductor chip module includes a substrate, a first radio frequency (RF) circuit block and a second RF circuit block mounted thereon, a conductive wall and a molding layer. The conductive wall is electrically connected to a ground potential and arranged between the first RF circuit block and the second RF circuit block. The molding layer is disposed over the substrate to cover the first RF circuit block and the second RF circuit block.
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