Fin cut for taper device

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United States of America Patent

PATENT NO 9647093
SERIAL NO

15073065

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Importance

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Abstract

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A method of making a semiconductor device includes patterning a fin in a substrate; performing a first etching process to remove a portion of the fin to cut the fin into a first cut fin and a second cut fin, the first cut fin having a first fin end and a second fin end and the second cut fin having a first fin end and a second fin end; forming an oxide layer along an endwall of the first fin end and an endwall of the second fin end of the first cut fin, and an endwall of the first fin end and an endwall of the second fin end of the second cut fin; disposing a liner onto the oxide layer disposed onto the endwall of the first fin end of the first cut fin to form a bilayer liner; and performing a second etching process to remove a portion of the second cut fin.

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Patent Owner(s)

  • GLOBALFOUNDRIES INC.;INTERNATIONAL BUSINESS MACHINES CORPORATION

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cheng, Kangguo Schenectady, US 3073 29638
Xie, Ruilong Schenectady, US 1423 10722
Yamashita, Tenko Schenectady, US 599 4956

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