Process for making a molded device assembly and printhead assembly

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United States of America Patent

PATENT NO 10232621
APP PUB NO 20170066242A1
SERIAL NO

15308562

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Abstract

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In one example, a process for making a micro device assembly includes placing a micro device on a front part of a printed circuit board, molding a molding on the printed circuit board surrounding the micro device, and then forming a channel to the micro device in a back part of the printed circuit board.

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Patent Owner(s)

  • HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Chien-Hua Corvallis, US 404 2914
Groh, Michael G Corvallis, US 24 171
Strand, Thomas R Corvallis, US 18 102

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