THERMAL INTERFACE MATERIAL
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United States of America Patent
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Issued Date -
Mar 9, 2017
app pub date -
May 17, 2016
filing date -
Sep 7, 2015
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Abstract
A thermal interface material comprises a fluoroelastomer component and a heat conductive filler evenly dispersed in the fluoroelastomer component. The fluoroelastomer component contains greater than 50% fluorine and has a Mooney viscosity ML(1+10) less than 60 at 121° C. The heat conductive filler comprises 40-65% by volume of the thermal interface material. The thermal interface material is manufactured by solventless processes, and has a heat conductivity between 0.7 W/m·K-9 W/m·K.
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