VAPOR DEPOSITION DEVICE AND METHOD EMPLOYING PLASMA AS AN INDIRECT HEATING MEDIUM
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United States of America Patent
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Issued Date -
Mar 9, 2017
app pub date -
Sep 8, 2015
filing date -
Sep 8, 2015
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Abstract
A vapor deposition device and a method for depositing a coating on a substrate are disclosed. The device includes a heating chamber for containing plasma and an evaporant chamber for containing an evaporant source. Evaporant is generated by heating of the evaporant source by the plasma. The heating chamber is both separated from the evaporant chamber and in thermally conductive connectivity with the evaporant chamber. The method includes supplying plasma to a heating chamber; heating an evaporant source by transfer of heat from the plasma to in an amount sufficient to generate evaporant from the evaporant source; and condensing the evaporant or a reaction product thereof on a surface of the substrate to form a coating thereon. The plasma is maintained in isolation from the evaporant source and the evaporant.
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