METHOD OF CLEANING AND MICRO-ETCHING SEMICONDUCTOR WAFERS
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United States of America Patent
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Aug 4, 2016
app pub date -
May 13, 2014
filing date -
Oct 14, 2009
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Abstract
A method of simultaneously cleaning inorganic and organic contaminants from semiconductor wafers and micro-etching the semiconductor wafers. After the semiconductor wafers are cut or sliced from ingots, they are contaminated with cutting fluid as well as metal and metal oxides from the saws used in the cutting process. Aqueous alkaline cleaning and micro-etching solutions containing alkaline compounds and mid-range alkoxylates are used to simultaneously clean and micro-etch the semiconductor wafers.
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