Semiconductor device and electronic apparatus encapsulated in resin with embedded filler particles
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jun 11, 2019
Grant Date -
Mar 9, 2017
app pub date -
Sep 7, 2016
filing date -
Sep 8, 2015
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A semiconductor device includes a semiconductor substrate, an analog circuit block including an active element arranged in the semiconductor substrate, a metal layer having a slit or a plurality of metal interconnects arranged in parallel, positioned above the analog circuit block, and a resin layer containing a filler, positioned above at least the metal layer or the plurality of metal interconnects. In the case of forming a semiconductor device by sealing a semiconductor chip with resin having a filler mixed therein, according to this semiconductor device, it is possible to suppress lowering of the level of precision of the electric characteristics of the analog circuit, and a variation in the characteristics or a change in the characteristics, in a mold packaging process, without using special materials or production methods.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully