Microelectronic assembly with redistribution structure formed on carrier
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United States of America Patent
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Feb 19, 2019
Grant Date -
Mar 9, 2017
app pub date -
Sep 6, 2016
filing date -
Sep 8, 2015
priority date (Note) -
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status (Latency Note)
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Abstract
A microelectronic assembly can be made by forming a redistribution structure supported on a carrier, the structure including two or more layers of deposited dielectric material and two or more electrically conductive layers and including conductive features such as pads and traces electrically interconnected by vias. Electrical connectors may project above a second surface of the structure opposite an interconnection surface of the redistribution structure adjacent to the carrier. A microelectronic element may be attached and electrically connected with conductive features at the second surface, and a dielectric encapsulation can be formed contacting the second surface and surfaces of the microelectronic element. Electrically conductive features at the interconnection surface can be configured for connection with corresponding features of a first external component, and the electrical connectors can be configured for connection with corresponding features of a second external component.
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