Stacked semiconductor device

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 10056400
APP PUB NO 20170069644A1
SERIAL NO

15059653

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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According to one embodiment, a semiconductor device includes a semiconductor substrate, a stacked body, and a first insulating film. The stacked body is provided on the semiconductor substrate. The stacked body includes first films, and second films being conductive. The first films and the second films are stacked alternately. The first insulating film extends in a stacking direction of the stacked body. The second films include a first portion and a second portion. The first portion is positioned between the first films. The second portion has a surface contacting the first insulating film in a direction perpendicular to the stacking direction.

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Patent Owner(s)

  • TOSHIBA MEMORY CORPORATION

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kikushima, Fumie Yokkaichi, JP 15 64
Kikutani, Keisuke Yokkaichi, JP 29 130

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