Semiconductor device and method for manufacturing the same

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United States of America Patent

PATENT NO 9929169
SERIAL NO

15008554

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Abstract

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According to one embodiment, the stacked body includes a plurality of electrode films stacked with an insulating body. The insulating body includes a first insulating film provided between the electrode films in a region surrounding the columnar portions. A gap is provided between the electrode films in a region on a lateral side in the first direction of the interconnect portion.

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Patent Owner(s)

  • TOSHIBA MEMORY CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Arai, Shinya Yokkaichi, JP 83 551

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