Soldering Device Minimizing Voids When Soldering Printed Circuit Boards

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United States of America Patent

SERIAL NO

15341487

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A soldering device for soldering a printed circuit board includes at least one heating appliance melting solder situated between electrical or electronic components being soldered onto a printed circuit board and the printed circuit board. At least one actuator mechanically oscillates the printed circuit board at a variable frequency of oscillation in a direction of a plane defioned by the printed circuit board. A second lateral edge of the printed circuit board, the second lateral edge being opposite to the first lateral edge of the printed circuit board, rests against iand supported by a fixed stop.

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Patent Owner(s)

Patent OwnerAddress
ERSA GMBH97877 WERTHEIM

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Rawinski, Viktoria Marktheidenfeld, DE 3 0

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