POLISHING PAD AND METHOD FOR PRODUCING SAME
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United States of America Patent
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Issued Date -
Mar 16, 2017
app pub date -
Jan 23, 2015
filing date -
Mar 14, 2014
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The purpose of the present invention is to provide: a polishing pad having a high polishing rate and excellent planarizing properties; and a method for producing the polishing pad. A polishing pad which has a polishing layer comprising a polyurethane resin foam, said polishing pad being characterized in that a polyurethane resin, which is a material used for forming the polyurethane resin foam, has an alkoxysilyl group represented by general formula (1) in a side chain thereof. (In the formula, X represents OR1 or OH; and R1's independently represent an alkyl group having 1 to 4 carbon atoms.)
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