ELECTROPLATING APPARATUS, ELECTROPLATING METHOD, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
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United States of America Patent
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Issued Date -
Mar 16, 2017
app pub date -
Sep 7, 2016
filing date -
Sep 10, 2015
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Abstract
According to an embodiment, an anode portion and a cathode portion are arranged in a reaction tank so as to opposite to each other with a distance provided. A plating solution which contains at least metal ions for plating, an electrolyte and a surfactant is provided in the reaction tank. A pattern of a metal plating film is formed on a surface of the cathode portion by setting the cathode portion at a negative electric potential with respect to an electric potential of the anode portion. A distance between the anode portion and a surface of a pattern of the metal plating film to be formed on the surface of the cathode portion is set to be smaller than a half value width of a cross-section of a portion of the pattern of the metal plating film having a minimum width.
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