Processing facility for manufacturing integrated circuits from semiconductor wafers as well as perforated panel for a processing facility

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 10208488
APP PUB NO 20170073978A1
SERIAL NO

15264655

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Abstract

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A processing facility for manufacturing integrated circuits on semiconductor wafers is provided with at least one radiation generator that generates an EUV (extreme ultraviolet) radiation that is supplied to at least one lithography machine, housed in a factory building, for exposure of the semiconductor wafers. The radiation generator is housed in a building or a building section separate from the factory building. At least one beam guide extends from the building or the building section to the factory building, wherein the EUV radiation is supplied from the building or the building section through the at least one beam guide to the factory building. At least one supply line branches off at an obtuse angle from the at least one beam guide inside the factory building, wherein at least a portion of the EUV radiation is supplied through the at least one supply line to the lithography machine.

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Patent Owner(s)

  • M+W GROUP GMBH

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Blaschitz, Herbert Leonberg, DE 7 212
Csatary, Peter Ditzingen, DE 1 0
Eberle, Freyja Remseck-Aldingen, DE 1 0
Köhler, Steffen Vaihingen an der Enz, DE 8 52
Schneider, Hartmut Stuttgart, DE 58 1053

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