SEMICONDUCTOR DEVICE
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United States of America Patent
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Issued Date -
Mar 16, 2017
app pub date -
Dec 22, 2015
filing date -
Sep 10, 2015
priority date (Note) -
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Abstract
According to one embodiment, there is provided a semiconductor device including a package. The package includes a first terminal, a second terminal, a semiconductor chip, and a sealing member. The first terminal is compatible with a first bus standard. The second terminal is compatible with a second bus standard. In the semiconductor chip, the first terminal and the second terminal are electrically connected. The sealing member covers one end of the first terminal and one end of the second terminal, exposes an other end of the first terminal and an other end of the second terminal, and covers the semiconductor chip.
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