Semiconductor device, semiconductor chip, and method of manufacturing semiconductor device
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United States of America Patent
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Apr 25, 2017
Grant Date -
Mar 16, 2017
app pub date -
Jan 20, 2016
filing date -
Sep 11, 2015
priority date (Note) -
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Abstract
A semiconductor device includes a semiconductor chip including first to fourth pads, and first and second switches. The first switch includes first and second nodes coupled to the first and second pads and sends from the second node a current larger than a threshold flowing in from the first node. The second switch includes third and fourth nodes coupled to the third and fourth pads and sends from the fourth node a current larger than a threshold flowing in from the third node. The third and fourth nodes are not coupled to any nodes of high and low potentials of any circuit which receives the potentials to operate. A first wire is coupled to the first pad and the first conductor, and a second wire is coupled to the second pad and the second conductor.
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