Semiconductor wafer with first and second stacked bodies and semiconductor memory device

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United States of America Patent

PATENT NO 9793287
SERIAL NO

15069158

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Abstract

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A semiconductor wafer including first and second stacked bodies provided on separate parts of a substrate. The first stacked body includes a first insulating and a second insulating film being provided on the first portion, the second stacked body includes a plurality of third insulating films and a plurality of electrode films. The third insulating films and the electrode films are alternately stacked, and a shape of an end portion of the second stacked body on a side opposing to the first stacked body is a stepped pattern.

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Patent Owner(s)

  • TOSHIBA MEMORY CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Iguchi, Tadashi Yokkaichi, JP 73 539

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