Heat Spreader in Multilayer Build Ups
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United States of America Patent
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Mar 2, 2015
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Feb 28, 2014
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Abstract
Connection system for electronic components, the connection system comprising at least one electrically insulating layer and at least one electrically conductive layer, wherein the connection system further comprises a heat distributing layer arranged within the at least one electrically insulating layer wherein the at least one heat distributing layer is made of thermally conductive, and electrically insulating, matrix-free material.
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