POLISHING COMPOSITION

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United States of America Patent

SERIAL NO

15126522

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The present invention provides a polishing composition suitable for polishing of a polishing object having a layer containing a Group IV material, the polishing composition making it possible to prevent the dissolution of the Group IV material.

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Patent Owner(s)

Patent OwnerAddress
FUJIMI INCORPORATEDKIYOSU-SHI AICHI 452-8502

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
TAMADA, Shuichi Kiyosu-shi, Aichi, JP 13 40

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