Modular thermal solution for high-performance processors

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United States of America Patent

PATENT NO 10299403
APP PUB NO 20170083058A1
SERIAL NO

14863073

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Various modular thermal management systems for a computing device and methods of using the same are disclosed. In one aspect, a method of providing thermal management for a heat generating component is provided. The method includes placing a heat sink in thermal contact with the heat generating component and coupling a shroud to the heat sink. The shroud has a first opening to direct air in a first direction past the heat sink and a second opening to direct air in a second direction past the heat sink. Air is moved through the first opening or the second opening.

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Patent Owner(s)

  • ADVANCED MICRO DEVICES INC.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Jaggers, Christopher Austin, US 7 72
Janak, Chris Austin, US 2 9
Merrikh, Ali Akbar Austin, US 10 55

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