FINGERPRINT SENSING DEVICE AND METHOD FOR PRODUCING THE SAME

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20170083736A1
SERIAL NO

15265240

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A fingerprint sensing device includes an insulating package, an image-sensing element, a light-emitting element, and a conductive component. The insulating package has a top surface that is formed with a first recess and a second recess, and a bottom surface that is opposite to the top surface. The conductive component is formed in the insulating package and has opposite top and bottom ends that are respectively exposed from the top and bottom surfaces of the insulating package. The image-sensing element is electrically connected to the conductive component by flip-chip techniques and has a sensing region that is exposed from the first recess. The light-emitting element is electrically coupled to the conductive component.

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Patent Owner(s)

Patent OwnerAddress
TONG HSING ELECTRONIC INDUSTRIES LTDNO 88 LN 1125 HEPING RD BADE DIST TAOYUAN CITY 334

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
CHIU, Zzu-Chi Taipei City, TW 8 4
WEI, Chien-Cheng Taipei City, TW 11 26

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