Chip resistor and method for manufacturing same
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United States of America Patent
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Mar 5, 2019
Grant Date -
Mar 23, 2017
app pub date -
Mar 11, 2015
filing date -
Mar 19, 2014
priority date (Note) -
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status (Latency Note)
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Abstract
A chip resistor including an insulating film covering a resistor making contact with a pair of electrodes formed on an upper surface of an insulating substrate and a method for manufacturing same are provided. Both electrodes include a main electrode layer that contains silver as a main metal component an 10 weight % or more of palladium as another metal component, and an auxiliary electrode layer lower in specific resistance than the main electrode layer, a laminate part where the auxiliary electrode layer and the main electrode layer are laminated in order on a single surface of the insulating substrate; and an exposed part of the auxiliary electrode layer where a part of the auxiliary electrode layer is not covered with the main electrode layer on a far side from the resistor, and part that extend from a near side to the far side with respect to the resistor.
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