ON-PACKAGE CONNECTOR
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United States of America Patent
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Issued Date -
Mar 23, 2017
app pub date -
Sep 22, 2015
filing date -
Sep 22, 2015
priority date (Note) -
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status (Latency Note)
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Abstract
Conventional ways of coupling die packages to external devices include providing contacts on a separate area on a printed circuit board (PCB). These PCB contacts are configured to mate with connector contacts of a connector to enable coupling with external devices. Unfortunately, the PCB contacts take up significant amount of area of the PCB. Also, the connection can suffer from parasitic losses and signal integrity can be compromised. An on-package connection is proposed to address the short comings of the conventional ways. The on-package connection enables a die package to connect directly with the connector. This removes the need to provide a separate area for PCB contacts. Also, parasitic losses are minimized and signal integrity is enhanced.
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