PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF
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United States of America Patent
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Issued Date -
Mar 23, 2017
app pub date -
Mar 18, 2016
filing date -
Sep 18, 2015
priority date (Note) -
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status (Latency Note)
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Abstract
A package substrate includes an encapsulating layer; a circuit pattern having an end embedded in the encapsulating layer; and a conductor disposed on a portion of the encapsulating layer, externally exposed, and electrically connected to the at least one end of the circuit pattern embedded in the encapsulating layer.
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