Importance

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Abstract

An optoelectronic component includes an optoelectronic semiconductor chip including a first and second electrical contacts; a first leadframe section comprising a first chip contact pad and a first soldering contact pad situated opposite the first chip contact pad; and a second leadframe section including a second chip contact pad and a second soldering contact pad situated opposite the second chip contact pad, wherein the first electrical contact electrically conductively connects to the first chip contact pad and the second electrical contact electrically conductively connects to the second chip contact pad, a dielectric element is arranged between the first and second leadframe sections, the first and second leadframe sections and the dielectric element are embedded into a housing such that at least parts of the first and second soldering contact pads are accessible, and a surface of the dielectric element is exposed at the underside of the housing.

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First Claim