Wafer-capped rechargeable power source

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United States of America Patent

PATENT NO 10446331
APP PUB NO 20170084888A1
SERIAL NO

14861725

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Abstract

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Embodiments of the present invention may provide a wafer-capped rechargeable power source. The wafer-capped rechargeable power source may comprise a device wafer, a rechargeable power source disposed on a surface of the device wafer, and a capping wafer to encapsulate the rechargeable power source. The rechargeable power source may include an anode component, a cathode component, and an electrolyte component.

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Patent Owner(s)

  • ANALOG DEVICES, INC.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Baoxing Westford, US 70 1937

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