CHIP PACKAGE AND METHOD FOR FORMING THE SAME
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United States of America Patent
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Issued Date -
Mar 30, 2017
app pub date -
Sep 21, 2016
filing date -
Sep 25, 2015
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Abstract
A chip package is provided. The chip package includes a first substrate including a sensing region or device region. The chip package also includes a second substrate. The first substrate is mounted on the second substrate and is electrically connected to the second substrate. The ratio of the thickness of the first substrate to the thickness of the second substrate is in a range from 2 to 8.
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