PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20170094786A1
SERIAL NO

15052222

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A printed circuit board according to the present invention includes at least one insulating layer and an interconnection. The insulating layer includes a first depression at an interface with the interconnection, and a second depression at a surface of the first depression.

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG ELECTRO-MECHANICS CO LTDMAEYOUNG-RO 150 (MAETAN-DONG) YOUNGTONG-GU SUWON-SI GYEONGGI-DO

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
KIM, Byung Kun Suwon-si, KR 20 22
KIM, Jun Hyeon Suwon-si, KR 11 14
LEE, Jae Joon Suwon-si, KR 117 617
OH, Young Joon Suwon-si, KR 10 6
OH, Yu Hong Suwon-si, KR 11 8
PARK, Ye Jun Suwon-si, KR 6 24
SEO, Jung Wook Suwon-si, KR 78 315

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