Method of fabricating a tamper-respondent assembly with region(s) of increased susceptibility to damage
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United States of America Patent
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Apr 23, 2019
Grant Date -
Mar 30, 2017
app pub date -
Aug 29, 2016
filing date -
Sep 25, 2015
priority date (Note) -
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Abstract
Methods of fabricating tamper-respondent assemblies provided which include a tamper-respondent electronic circuit structure. The tamper-respondent electronic circuit structure includes a tamper-respondent sensor. The tamper-respondent sensor includes, for instance, at least one flexible layer having opposite first and second sides, and circuit lines forming, at least in part, at least one tamper-detect network, such as one or more resistive networks. The circuit lines are disposed on at least one of the first side or the second side of the at least one flexible layer. At least one region of the tamper-respondent sensor is fabricated with increased susceptibility to damage from mechanical stress associated with a tamper event. The at least one region of increased susceptibility to damage facilitates detection of the tamper event by the tamper-respondent sensor.
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