RESIN COMPOSITION AND MOLDED ARTICLE
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United States of America Patent
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app pub date -
Dec 15, 2016
filing date -
Apr 17, 2013
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Abstract
A resin composition contains: 60 to 95% by mass of polyphenylene ether (A); 35 to 0% by mass of styrene-based resin (B); and 15 to 5% by mass of elastomer component (C). The component (C) is present as dispersion particles in the resin composition. The dispersion particles have a number average particle size of 0.04 to 0.25 μm.
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