PACKING FOR SUBSTRATE PLATING JIG AND SUBSTRATE PLATING JIG USING THE SAME
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United States of America Patent
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Issued Date -
Apr 6, 2017
app pub date -
Mar 27, 2014
filing date -
Mar 27, 2014
priority date (Note) -
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status (Latency Note)
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Abstract
A packing for a plating jig attached to a plating jig for sealing conductive members for supplying power to a substrate and portions of the substrate surface in contact with the conductive members from a plating solution, including a packing main body formed from a long elastic member having ends and a connecting member which connects and fix connection ends of both end portions of the packing main body to each other for allowing the packing main body to be an endless shape. The connecting member includes a shaft portion and plural hooks provided to protrude at a prescribed angle from the shaft portion, and when both connection ends of the packing main body are linked, the connecting member is internally provided to extend inside the packing main body in both directions from a connecting point within a prescribed range over the connecting point where the connection ends are linked.
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