Semiconductor structure and method for manufacturing a semiconductor structure

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United States of America Patent

PATENT NO 9989703
SERIAL NO

15379523

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Abstract

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A semiconductor structure and a method for manufacturing the semiconductor structure are provided. The semiconductor structure includes a processed semiconductor substrate. The processed semiconductor substrate includes active electronic components. The semiconductor structure also includes a dielectric layer that covers, at least partially, the processed semiconductor substrate. An interface layer that is suitable for growing optically active material on the interface layer is bonded to the dielectric layer. An optical gain layer and the processed semiconductor substrate are connected through the dielectric layer by electric and/or optical contacts.

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Patent Owner(s)

  • INTERNATIONAL BUSINESS MACHINE CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Czornomaz, Lukas Zurich, CH 60 406
Fompeyrine, Jean Waedenswil, CH 53 428
Hofrichter, Jens Gattikon, CH 42 164
Offrein, Bert Jan Schoenenberg, CH 29 200
Richter, Mirja Staefa, CH 6 47

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